Solvent prewet and method to dispense the solvent prewet
US6884462B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 30, 2004 |
| Grant date | Apr 26, 2005 |
| Priority date | — |
| Expiry date | Apr 30, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/16
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method and apparatus is provided for more efficient application of photoresist to a wafer surface. One aspect of the method comprises applying solvent to the wafer and spinning it to coat the entire wafer surface prior to the application of photoresist. This reduces surface tension on the wafer and reduces the amount of resist required to achieve a high quality film. The apparatus comprises adding a third solenoid and nozzle to the coating unit to accommodate the application of solvent to the center of the wafer surface. The method also describes incorporating a new solvent comprising diacetone alcohol, which is a low-pressure solvent, providing extended process latitudes and reduced material expenditures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.