Method for forming an LED device with a metallic substrate
US6884646B1 · kind B1 · utility
21Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 10, 2004 |
| Grant date | Apr 26, 2005 |
| Priority date | — |
| Expiry date | Mar 10, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/018
Abstract
An LED epitaxial structure and a first electrode layer are formed on a provisional substrate in sequence. Then, a metallic permanent substrate is formed on the first electrode layer, and the provisional substrate is removed to expose a surface of the LED epitaxial structure. A plurality of second electrodes is formed on the surface of the LED epitaxial structure. Finally, the metallic permanent substrate, the first electrode layer, and the LED epitaxial structure are diced to form a plurality of LED devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.