Folded interposer
US6884653B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 21, 2001 |
| Grant date | Apr 26, 2005 |
| Priority date | — |
| Expiry date | Mar 21, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10378
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A folded interposer used to achieve a high density semiconductor package is disclosed. The folded interposer is comprised of a thin, flexible material that can be folded around one or multiple semiconductor dice in a serpentine fashion. The semiconductor dice are then attached to a substrate through electrical contacts on the interposer. The folded interposer allows multiple semiconductor dice to be efficiently stacked in a high density semiconductor package by reducing the unused or waster space between stacked semiconductor dice. Vias extending through the folded interposer provide electrical communication between the semiconductor dice and the substrate. The present invention also relates to a method of packaging semiconductor dice in a high density arrangement and a method of forming the high density semiconductor package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.