Enhanced adhesion strength between mold resin and polyimide
US6884662B1 · kind B1 · utility
1Cited by
11References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2002 |
| Grant date | Apr 26, 2005 |
| Priority date | — |
| Expiry date | Apr 22, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A new method is provided for the interface between a stress relieve interface layer of polyimide and a thereover created layer of mold compound. The invention provides for creating a pattern in the stress relieve layer of polyimide before the layer of mold compound is formed over the stress relieve layer of polyimide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.