I/C package/ thermal-solution retention mechanism with spring effect
US6884943B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2003 |
| Grant date | Apr 26, 2005 |
| Priority date | — |
| Expiry date | Aug 4, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thin, lightweight retention mechanism with a spring force holds an integrated circuit package to a circuit board. The retention mechanism consists of a pressure plate, a backing plate, and a fastening means for applying a deforming force to the plates, such as screws and nuts. The plates are paraboloid or dish-shaped and made of an elastically deformable material, such as steel. The fastening means simultaneously applies deforming forces to the peripheries of the plates to create a continuous spring force to effect electrical continuity between the integrated circuit package and the circuit board. In addition, a method of testing the retention mechanism and a method of assembling the retention mechanism are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.