Leo Ofman
6Patents
6h-index
9Co-inventors
56Inventor score
Filing activity: Jan 14, 1983 → Mar 22, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6661660B2 | Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment | Electricity | 36 | Expired |
| US6657131B2 | I/C package / thermal-solution retention mechanism with spring effect | Emerging Cross-Sectional Technologies | 32 | Expired |
| US6639799B2 | Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment | Electricity | 28 | Expired |
| US7096580B2 | I/C package/thermal-solution retention mechanism with spring effect | Emerging Cross-Sectional Technologies | 15 | Expired |
| US4589547A | Carrier for stacked semiconductor die | Electricity | 7 | Expired |
| US6884943B1 | I/C package/ thermal-solution retention mechanism with spring effect | Emerging Cross-Sectional Technologies | 7 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.