Multi-chip semiconductor LED assembly
US6885035B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 15, 2001 |
| Grant date | Apr 26, 2005 |
| Priority date | — |
| Expiry date | May 15, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H29/142
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light emitting device includes several LEDs, mounted on a shared submount, and coupled to circuitry formed on the submount. The LEDs can be of the III-Nitride type. The architecture of the LEDs can be either inverted, or non-inverted. Inverted LEDs offer improved light generation. The LEDs may emit light of the same wavelength or different wavelengths. The circuitry can couple the LEDs in a combination of series and parallel, and can be switchable between various configurations. Other circuitry can include photosensitive devices for feedback and control of the intensity of the emitted light, or an oscillator, strobing the LEDs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.