Flat leadframe for a semiconductor package
US6885088B2 · kind B2 · utility
0Cited by
3References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 20, 2003 |
| Grant date | Apr 26, 2005 |
| Priority date | — |
| Expiry date | Feb 20, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The leadframe has a perforation to form, between a central platform and a peripheral part located a certain distance apart, radiating elongate leads. The leadframe has, on its rear face that comes into contact with a bearing surface of a mold, at least one recess and a groove for connecting this recess to the perforation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.