Device for supporting thin semiconductor wafers
US6885206B2 · kind B2 · utility
11Cited by
13References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 11, 2003 |
| Grant date | Apr 26, 2005 |
| Priority date | — |
| Expiry date | Feb 11, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/0416
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A device for supporting and securing thin wafers comprising a housing having an upper shelf extending radially inwardly from the housing and a lower shelf extending radially inwardly from the upper shelf. An upper seal is disposed within the upper shelf and an inspection windowpane is disposed within the lower shelf. A vacuum is provided between the inspection windowpane and the upper seal to secure the wafer to the inspection windowpane and to secure the inspection windowpane to the housing. A ring-shaped frame assembly may further support and secure the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.