Apparatus and methods for multi-step chemical mechanical polishing
US6887136B2 · kind B2 · utility
9Cited by
5References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 9, 2001 |
| Grant date | May 3, 2005 |
| Priority date | — |
| Expiry date | Dec 2, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical mechanical polishing apparatus has a rotatable platen, a generally linear polishing sheet having an exposed portion extending over a top surface of the platen for polishing the substrate, and a drive mechanism to incrementally advance the polishing sheet in a linear direction across a top surface of the platen. The polishing sheet is releasably secured to the platen to rotate with the platen, and it has a width greater than a diameter of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.