Method for fabricating a CMP pad having isolated pockets of continuous porosity
US6887336B2 · kind B2 · utility
3Cited by
16References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 26, 2002 |
| Grant date | May 3, 2005 |
| Priority date | — |
| Expiry date | Aug 27, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S451/921
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for fabricating a chemical mechanical polishing pad and a system and a method for using such a pad are described. The method comprises providing a continuously porous pad and forming non-porous regions on the pad in a pattern which segregates a pluarlity of porous regions from one another, wherein each of the porous regions includes a plurality of interconnected pores. The non-porous matrix may include a network of trenches, or may have pores which have been filled with a material. The material may include a polymer resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.