Method for exposing a semiconductor wafer

US6887722B2 · kind B2 · utility

Assignee

• Infineon Technologies SC 300 GmbH & Co. KG · DE

Inventors

• Thorsten Schedel · Dresden, DE
• Torsten Seidel · Dresden, DE

Key dates

• Filing date: May 9, 2003
• Grant date: May 3, 2005
• Expiry date: Oct 20, 2023

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S438/946
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

A method for exposing a semiconductor wafer compensates for the effects of process inhomogeneities, e.g. in semiconductor etching or deposition processes, by individually adjusting sets of exposure parameters of an exposure tool for any exposure field. The exposure parameters are preferably the dose and the focus, which are varied across the semiconductor wafer.