Programmable photolithographic mask system and method
US6888616B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2003 |
| Grant date | May 3, 2005 |
| Priority date | — |
| Expiry date | Jun 25, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70291
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention overcomes many of the disadvantages of prior lithographic microfabrication processes while providing further improvements that can significantly enhance the ability to make semiconductor chips at lower cost. A new type of programmable structure for exposing a wafer allows the lithographic pattern to be changed under electronic control. This provides great flexibility, increasing the throughput and decreasing the cost of chip manufacture and providing numerous other advantages. The programmable structure consists of an array of shutters that can be programmed to either transmit light to the wafer (referred to as its “open” state) or not transmit light to the wafer (referred to as its “closed” state). The programmable technique is provided for creating a pattern to be imaged onto a wafer that can be implemented as a viable production technique.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.