Method of manufacturing printed-circuit board
US6889433B1 · kind B1 · utility
44Cited by
10References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2000 |
| Grant date | May 10, 2005 |
| Priority date | — |
| Expiry date | Aug 5, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
By filling a predetermined amount of conductive paste into an opening for forming a through hole or a VH formed in a resin insulating layer of a circuit board, and pressurizing the filled conductive paste under the condition of reduced pressure, removing air bubble strapped in the conductive paste.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.