Process condition sensing wafer and data analysis system
US6889568B2 · kind B2 · utility
21Cited by
26References
33Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 24, 2002 |
| Grant date | May 10, 2005 |
| Priority date | — |
| Expiry date | Jan 24, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.