Polymer film metalization
US6890813B2 · kind B2 · utility
0Cited by
20References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 6, 2003 |
| Grant date | May 10, 2005 |
| Priority date | — |
| Expiry date | Jan 6, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/033
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments in accordance with the present invention eliminate the need for a subtractive metal patterning process to pattern the electrode above a ferroelectric polymer. Instead, a selective electroless deposition process is used. A conductive polymer is used as a seed layer for the electroless plating of the metal electrode. A cost saving is provided by eliminating the chemical costs associated with conventional resist removal processing. The methods also potentially eliminate the requirement for aggressive and environmentally unsafe chemical-based photoresist removal processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.