Semiconductor package having dam and method for fabricating the same
US6891259B2 · kind B2 · utility
42Cited by
17References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 21, 2003 |
| Grant date | May 10, 2005 |
| Priority date | — |
| Expiry date | Aug 23, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16151
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package including a dam and a method for fabricating the same are provided. The semiconductor package comprises a package substrate, a semiconductor chip attached to the substrate, a TIM formed on the semiconductor chip, a dam that substantially surrounds the TIM, and a lid placed over the TIM to contact a surface thereof. Thus, a TIM can be prevented from flowing down from the original position at high temperatures. Therefore, the performance of the semiconductor package does not deteriorate even at high temperatures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.