Young-Hoon Ro
10Patents
6h-index
13Co-inventors
59Inventor score
Filing activity: Oct 9, 2001 → Mar 5, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6891259B2 | Semiconductor package having dam and method for fabricating the same | Electricity | 42 | Expired |
| US6518660B2 | Semiconductor package with ground projections | Electricity | 14 | Expired |
| US7630209B2 | Universal PCB and smart card using the same | Electricity | 12 | Active |
| US7855895B2 | Universal PCB and smart card using the same | Electricity | 12 | Active |
| US7579583B2 | Solid-state imaging apparatus, wiring substrate and methods of manufacturing the same | Electricity | 8 | Expired |
| US7405760B2 | Image pickup device with non-molded DSP chip and manufacturing method | Electricity | 7 | Expired |
| US6608380B2 | Semiconductor chip package having one or more sealing screws | Electricity | 6 | Expired |
| US9502341B2 | Printed circuit board and semiconductor package using the same | Electricity | 1 | Active |
| US8274144B2 | Helical springs electrical connecting a plurality of packages | Electricity | 1 | Active |
| US8446018B2 | Package on package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.