Probe card cooling assembly with direct cooling of active electronic components
US6891385B2 · kind B2 · utility
96Cited by
40References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 27, 2001 |
| Grant date | May 10, 2005 |
| Priority date | — |
| Expiry date | Mar 28, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2891
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A probe card cooling assembly for use in a test system includes a package with one or more dies cooled by direct cooling. The cooled package includes one or more dies with active electronic components and at least one coolant port that allows a coolant to enter the high-density package and directly cool the active electronic components of the dies during a testing operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.