Measurement box with module for measuring wafer characteristics
US6891609B2 · kind B2 · utility
0Cited by
5References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 11, 2002 |
| Grant date | May 10, 2005 |
| Priority date | — |
| Expiry date | Jun 5, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A measurement box which can be integrated into existing wafer processing equipment. The measurement box comprises an enclosure which contains a measurement module for measuring objects such as the surfaces of wafers. The measurement module is equipped with a miniaturized measuring device and has a displaceable measuring head and a plane table with a rotatable wafer holder. The enclosure has at least one loading opening for the wafer to pass through as well as a ventilation device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.