Integrated temperature sensor
US6893154B2 · kind B2 · utility
15Cited by
53References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 19, 2002 |
| Grant date | May 17, 2005 |
| Priority date | — |
| Expiry date | Apr 28, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K2215/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus and method are provided for sensing a physical stimulus of an integrated circuit. The apparatus and method allow for accurate die temperature measurements of the integrated circuit and are able to provide a highly accurate die temperature measurement without the need for an independent voltage source or current source.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.