Optical semiconductor package and process for fabricating the same
US6893169B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2000 |
| Grant date | May 17, 2005 |
| Priority date | — |
| Expiry date | Nov 7, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process is provided for fabricating an optical semiconductor package. According to the process, a first semiconductor component is fixed to a rear face of an electrical connection support plate, and this first component is electrically connected to the support plate. An encapsulation block for the first component is molded on the rear face of the support plate. A second semiconductor component, a front face of which has an optical sensor, is fixed to one face of the first component, and this second component is electrically connected to the support plate. The second component is encapsulated on the front face of the support plate. Also provided is an optical semiconductor package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.