Conductive polishing pad with anode and cathode
US6893328B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 23, 2003 |
| Grant date | May 17, 2005 |
| Priority date | — |
| Expiry date | Apr 23, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S451/908
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A conductive polishing pad that includes one or more anodes and one or more cathodes formed at or near the polishing surface of a polishing pad. The anodes and cathodes are connected to a wiring network that is part of an electrical connector system that allows for a current source to be connected to the polishing pad and provide a current to the anodes and cathodes even if the polishing pad is moving relative to the current source. An electrolytic polishing fluid introduced between the polishing surface and the metal layer of a wafer forms an electrical circuit between the anode, cathode and the metal layer. The conductive polishing pad allows for electrochemical mechanical polishing (ECMP) to be performed on a conventional chemical mechanical polishing (CMP) tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.