Multi-port chemical dispense
US6893504B1 · kind B1 · utility
0Cited by
3References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 23, 1999 |
| Grant date | May 17, 2005 |
| Priority date | — |
| Expiry date | Sep 15, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6715
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for applying conservative amounts of a fluid to coat a silicon wafer surface. The surface is rotated and the fluid is applied to the surface through multiple application ports. Centrifugal forces spread the fluid across the wafer surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.