MEMS capping method and apparatus

US6893574B2 · kind B2 · utility

Inventors

• Lawrence E. Felton · Hopkinton, US
• Peter Farrell · Lunenburg, US
• Jing Luo · Kunshan, CN
• David J. Collins · Scotia, US
• John R. Martin · Foxborough, US
• William A. Webster · Tewksbury, US

Key dates

• Filing date: Oct 23, 2001
• Grant date: May 17, 2005
• Expiry date: Sep 25, 2022

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A MEMS capping method and apparatus uses a cap structure on which is formed a MEMS cavity, a cut capture cavity, and a cap wall. The cap wall is essentially the outer wall of the MEMS cavity and the inner wall of the cut capture cavity. The cap structure is bonded onto a MEMS structure such that the MEMS cavity covers protected MEMS components. The cap structure is trimmed by cutting through to the cut capture cavity from the top of the cap structure without cutting all the way through to the MEMS structure.