Substrate processing apparatus and substrate processing method
US6893805B2 · kind B2 · utility
14Cited by
3References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2002 |
| Grant date | May 17, 2005 |
| Priority date | — |
| Expiry date | Dec 8, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76819
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing apparatus provided with: a coating processing section for supplying a coating solution to a substrate; a pressure processing section for pressurizing a coating film formed on the substrate; and a developing processing section for supplying a developing solution to the substrate having the coating film selectively exposed to light with the use of an exposure mask. The pressure processing section may be arranged such that a pressing plate having a flat face is brought into pressure contact with the coating film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.