Carrier with metal bumps for semiconductor die packages
US6893901B2 · kind B2 · utility
62Cited by
5References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 14, 2001 |
| Grant date | May 17, 2005 |
| Priority date | — |
| Expiry date | Nov 9, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A carrier for a semiconductor die package is disclosed. In one embodiment, the carrier includes a metal layer and a plurality of bumps formed in the metal layer. The bumps can be formed by stamping.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.