Ruben Madrid
18Patents
7h-index
9Co-inventors
55Inventor score
Filing activity: Oct 31, 1997 → Jan 13, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6777800B2 | Semiconductor die package including drain clip | Electricity | 135 | Expired |
| US6893901B2 | Carrier with metal bumps for semiconductor die packages | Electricity | 62 | Expired |
| US7023077B2 | Carrier with metal bumps for semiconductor die packages | Electricity | 47 | Expired |
| US6646329B2 | Power chip scale package | Electricity | 37 | Expired |
| US7663211B2 | Dual side cooling integrated power device package and module with a clip attached to a leadframe in the package and the module and methods of manufacture | Electricity | 26 | Active |
| US8193618B2 | Semiconductor die package with clip interconnection | Electricity | 11 | Active |
| US6861286B2 | Method for making power chip scale package | Electricity | 9 | Expired |
| US8193622B2 | Thermally enhanced thin semiconductor package | Electricity | 7 | Active |
| US6006981A | Wirefilm bonding for electronic component interconnection | Emerging Cross-Sectional Technologies | 7 | Expired |
| US7821116B2 | Semiconductor die package including leadframe with die attach pad with folded edge | Electricity | 7 | Active |
| US6707135B2 | Semiconductor leadframe for staggered board attach | Emerging Cross-Sectional Technologies | 7 | Expired |
| US7402462B2 | Folded frame carrier for MOSFET BGA | Electricity | 4 | Active |
| US7002240B2 | Semiconductor leadframe for staggered board attach | Emerging Cross-Sectional Technologies | 4 | Expired |
| US7576429B2 | Packaged semiconductor device with dual exposed surfaces and method of manufacturing | Electricity | 3 | Active |
| US7893548B2 | SiP substrate | Electricity | 2 | Active |
| US6857459B1 | Wirefilm bonding for electronic component interconnection | Emerging Cross-Sectional Technologies | 2 | Expired |
| US8372690B2 | SiP substrate | Electricity | 0 | Active |
| US7816178B2 | Packaged semiconductor device with dual exposed surfaces and method of manufacturing | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.