Patent · US Expired

Process for producing microelectromechanical components and a housed microelectromechanical component

US6894358B2 · kind B2 · utility

42Cited by

7References

46Claims

0Family size

Assignee

Schott Glas · DE

Inventors

Jürgen Leib · Freising, DE
Florian Bieck · Singapore, SG

Key dates

Filing date	Aug 26, 2002
Grant date	May 17, 2005
Priority date	—
Expiry date	Aug 26, 2022

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81B2207/096
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

A microelectromechanical component is produced from a substrate having a first side and a second side which is substantially opposite from the first side, at least the first side having at least one microelectromechanical element, by introducing at least one conductive passage is introduced into the substrate, connecting the first side to the second side.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.