Inventor · Singapore, SG

Florian Bieck

15Patents
6h-index
5Co-inventors
55Inventor score

Filing activity: Aug 26, 2002 → Feb 28, 2015

Most-cited inventions

PatentTitleAreaCited byStatus
US6894358B2 Process for producing microelectromechanical components and a housed microelectromechanical component Performing Operations; Transporting 42 Expired
US6911392B2 Process for making contact with and housing integrated circuits Electricity 40 Expired
US7285834B2 Process for producing microelectromechanical components and a housed microelectromechanical component Performing Operations; Transporting 28 Expired
US7160478B2 Method for producing electronic componets Electricity 28 Expired
US7071521B2 Process for producing microelectromechanical components and a housed microelectromechanical component Performing Operations; Transporting 27 Expired
US7700957B2 Process for making contact with and housing integrated circuits Electricity 7 Expired
US7825029B2 Method for the production of structured layers on substrates Electricity 3 Active
US7821106B2 Process for making contact with and housing integrated circuits Electricity 2 Active
US9245765B2 Apparatus and method of applying a film to a semiconductor wafer and method of processing a semiconductor wafer Emerging Cross-Sectional Technologies 1 Active
US8114304B2 Method for producing electronic components Electricity 1 Active
US9207276B2 Method and apparatus for testing a semiconductor wafer Physics 1 Active
US9063407B2 Photolithography mask method for a wafer, method for producing same, and photolithography method for wafer using the same Physics 0 Active
US9000512B1 Packaging of electronic circuitry Electricity 0 Active
US9076779B1 Packaging of electronic circuitry Electricity 0 Active
US9929018B2 Semiconductor wafer and method for producing same Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.