Method and device for time measurement on semiconductor modules employing the ball-grid-array technique

US6894525B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Simon Muff · Mering, DE
• Abdallah Bacha · Munich, DE

Key dates

• Filing date: Feb 6, 2004
• Grant date: May 17, 2005
• Expiry date: Feb 6, 2024

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R31/31937
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A method and a device for time measurement at a designated signal pin or associated solder pad on a semiconductor module on which semiconductor chips are mounted using the ball-grid-array technique. Integrated on the semiconductor module in the direct vicinity of a solder pad associated with the signal pin to be measured is an equivalent conductor pattern, which can be loaded with passive components in such a way that, in the loaded state, it forms an equivalent load circuit for the designated signal pin which simulates the time-relevant characteristic electrical values of the designated signal pin. The measurement takes place after connection of the ELC to a solder pad associated with the signal pin, with the semiconductor chip detached from the semiconductor module.