Method and apparatus for controlling a multi-chamber processing tool
US6895295B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 6, 2002 |
| Grant date | May 17, 2005 |
| Priority date | — |
| Expiry date | Apr 3, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70991
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for controlling a processing tool having a plurality of chambers includes processing a wafer in a first chamber of the processing tool; measuring a characteristic of the wafer; and modifying an operating recipe of one of the plurality of chambers based on the measured characteristic. A system for processing semiconductor wafers includes a processing tool, a metrology tool, and a process controller. The processing tool includes a plurality of chambers. The metrology tool is adapted to measure a characteristic of a wafer processed in a first chamber of the processing tool. The process controller is adapted to modify an operating recipe of one of the plurality of chambers based on the measured characteristic.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.