Acoustic streaming of condensate during sputtered metal vapor deposition
US6896774B2 · kind B2 · utility
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2References
15Claims
0Family size
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Key dates
| Filing date | Mar 6, 2003 |
| Grant date | May 24, 2005 |
| Priority date | — |
| Expiry date | Apr 2, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76877
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Metal may be deposited into trenches, vias, or other wafer openings using a physical vapor deposition chamber under vacuum. Sonic energy may be applied directly to the wafer having the openings to be filled. As a result, pinching off of the openings may be reduced or eliminated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.