System and method for reducing heat dissipation during burn-in
US6897671B1 · kind B1 · utility
7Cited by
13References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 1, 2004 |
| Grant date | May 24, 2005 |
| Priority date | — |
| Expiry date | Mar 1, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/31721
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Systems and methods for reducing temperature dissipation during burn-in testing are described. A plurality of devices under test are each subject to a body bias voltage. The body bias voltage is selected to substantially minimize leakage current associated with the plurality of devices under test. Accordingly, heat dissipation is reduced during burn-in.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.