Apparatus and method for measuring alignment accuracy, as well as method and system for manufacturing semiconductor device
US6897956B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 6, 2002 |
| Grant date | May 24, 2005 |
| Priority date | — |
| Expiry date | Nov 15, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4638
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus for measuring an alignment accuracy between overlaid alignment marks formed to each of alignment mark portions on every plural chip units or exposure units arranged on a substrate to be measured, comprising: an XY stage running in a direction x and in a direction y while mounting the substrate; an illumination optical system for illuminating each of the alignment mark portions in a state where the XY stage runs in a direction x which is a direction of arranging the chips; a detecting optical system having an objective lens for collecting a reflection light in the running state obtained from the overlaid alignment marks, a focusing optical system for focusing the reflection light in the running state obtained from the objective lens, a scanning optical system for scanning reflection light image in the running state focused by the focusing optical system in a direction opposite to that of the running and a linear image sensor receiving reflection light image substantially in a static state being scanned in the opposite direction by the scanning optical system and converting them into image signal; and an alignment accuracy calculation device for measuring the alignment a…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.