Test structure for determining the electrical loadability of contacts

US6899543B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Klaus Goller · Dresden, DE
• Roland Wenzel · Munich, DE

Key dates

• Filing date: Nov 14, 2003
• Grant date: May 31, 2005
• Expiry date: Nov 14, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A test structure can be used to determine the electrical loadability of contacts. This structure includes a first interconnect line and a second interconnect line arranged above the first interconnect line. A via electrically couples the first interconnect line to the second interconnect line. A plurality of additional conductive structures are arranged in a closely adjacent manner around the via. These additional structures lie in the same plane as either the first interconnect line or the second interconnect line.