Microporous polishing pads
US6899598B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 3, 2004 |
| Grant date | May 31, 2005 |
| Priority date | — |
| Expiry date | Mar 3, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2105/041
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention provides polishing pads for chemical-mechanical polishing comprising a porous foam and a method for their production. In one embodiment, the porous foam has an average pore size of about 50 μm or less, wherein about 75% or more of the pores have a pore size within about 20 μm or less of the average pore size. In another embodiment, porous foam has an average pore size of about 20 μm or less. In yet another embodiment, the porous foam has a multi-modal pore size distribution. The method of production comprises (a) combining a polymer resin with a supercritical gas to produce a single-phase solution and (b) forming a polishing pad from the single-phase solution, wherein the supercritical gas is generated by subjecting a gas to an elevated temperature and pressure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.