Polishing pad for a semiconductor device having a dissolvable substance
US6899611B2 · kind B2 · utility
19Cited by
12References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2002 |
| Grant date | May 31, 2005 |
| Priority date | — |
| Expiry date | Jan 10, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31591
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad used in a method for polishing a semiconductor device is made by combining a polymeric matrix and a dissolvable substance that dissolves upon contact with a polishing slurry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.