Plasma processing apparatus and plasma processing system with reduced feeding loss, and method for stabilizing the apparatus and system
US6899787B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 14, 2002 |
| Grant date | May 31, 2005 |
| Priority date | — |
| Expiry date | Dec 3, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32183
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A plasma processing unit has two electrodes for exciting a plasma, a plasma processing chamber, an RF generator, a matching circuit for performing impedance matching between the plasma processing chamber and the RF generator, a feeder that connects an output terminal of the matching circuit to one of the electrode, and a supplier that connects the RF generator to an input terminal of the matching circuit. The feeder is arranged to decrease the average density per unit volume of the RF power supplied from the RF generator as the RF power flows from the output terminal of the matching circuit to the electrode. The section of the plasma processing unit that is DC-grounded has a surface provided with a low-resistance portion. The supplier or the feeder is fixed on a floor using RF impedance adjustors so as to prevent the RF impedance therein from changing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.