Abrasive liquid for metal and method for polishing
US6899821B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 15, 2001 |
| Grant date | May 31, 2005 |
| Priority date | — |
| Expiry date | Oct 15, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An abrasive liquid for a metal comprising (1) an oxidizing agent for a metal, (2) a dissolving agent for an oxidized metal, (3) a first protecting film-forming agent such as an amino acid or an azole which adsorbs physically on the surface of the metal and/or forms a chemical bond, to thereby form a protecting film, (4) a second protecting film-forming agent such as polyacrylic acid, polyamido acid or a salt thereof which assists the first protecting film-forming agent informing a protecting film and (5) water; and a method for polishing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.