Conductive polymer colloidal compositions with selectivity for non-conductive surfaces
US6899829B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2001 |
| Grant date | May 31, 2005 |
| Priority date | — |
| Expiry date | Jan 8, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/188
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A conductive polymer colloidal composition that selectively forms a coating on a non-conductive surface. The conductive polymer colloidal composition is composed of a polymer and a sulfonate dopant. The conductive polymer colloidal composition may also contain conductive colloidal particles such as conductive carbon or metal salt particles, oxidants, stabilizers, and preservatives. The conductive polymer colloidal composition may be employed to selectively coat the non-conductive parts of printed wiring boards such that a uniform metal layer can be deposited on the conductive polymer coat. In addition to a uniform metal layer being formed over the conductive polymer, adhesion between the metal layer and the printed wiring board is improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.