Single workpiece processing system
US6900132B2 · kind B2 · utility
8Cited by
13References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 22, 2003 |
| Grant date | May 31, 2005 |
| Priority date | — |
| Expiry date | Oct 22, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/913
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system for processing semiconductor wafers has process units on a deck of a frame. The process units and the deck have precision locating features, such as tapered pins, for precisely positioning the process units on the deck. Process units can be removed and replacement process units installed on the deck, without the need for recalibrating the load/unload robot. This reduces the time needed to replace process units and restart processing operations. Liquid chemical consumption during processing is reduced by drawing unused liquid out of supply lines and pumping it back to storage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.