Patent · US Expired

POLY-O-HYDROXYAMIDES, POLYBENZOXAZOLES, PROCESSES FOR PRODUCING POLY-O-HYDROXYAMIDES, PROCESSES FOR PRODUCING POLYBENZOXAZOLES, DIELECTRICS INCLUDING A POLYBENZOXAZOLE, ELECTRONIC COMPONENTS INCLUDING THE DIELECTRICS, AND PROCESSES FOR MANUFACTURING THE ELECTRONIC COMPONENTS

US6900284B2 · kind B2 · utility

2Cited by

7References

4Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Klaus Lowack · Erlangen, DE
Anna Maltenberger · Leutenbach, DE
Recai Sezi · Simmerath, DE
Andreas Walter · Egloffstein, DE

Key dates

Filing date	Sep 30, 2002
Grant date	May 31, 2005
Priority date	—
Expiry date	Dec 18, 2022

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3011
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Poly-o-hydroxyamides are cyclicized to obtain polybenzoxazoles. The poly-o-hydroxyamides provide effective filling of trenches. In particular, the poly-o-hydroxyamides can fill trenches having a width of less than 100 nm and an aspect ratio of more than 4. Further, the polybenzoxazoles of the invention are very suitable for the damascene process. A dielectric can be made from the polybenzoxazole. In turn, semiconductor devices can include the dieletric. Processes for making the poly-o-hydroxyamides, polybenzoxazoles, and semiconductor devices are included.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.