Flexible printed wiring board with semiconductor chip and releasing layer
US6900989B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 12, 2003 |
| Grant date | May 31, 2005 |
| Priority date | — |
| Expiry date | Apr 30, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2848
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a printed circuit board whose insulating layer is not melt-adhered to a heating tool, to thereby enhance reliability and productivity of a semiconductor chip mounting line, and also provides a method of producing the printed circuit board. The printed circuit board contains a flexible printed wiring board and a semiconductor chip mounted on the flexible printed wiring board, wherein the flexible printed wiring board includes: an insulating layer 12 and a wiring pattern 21 formed of a conductor layer 11 provided on at least one side of the insulating layer 12 and a releasing layer 13 provided on a surface of the insulating layer 12, which surface is opposite to the mounting side of the semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.