Ken Sakata
4Patents
3h-index
1Co-inventors
33Inventor score
Filing activity: Mar 11, 2003 → Mar 14, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7255919B2 | Mold release layer transferring film and laminate film | Emerging Cross-Sectional Technologies | 87 | Expired |
| US7173322B2 | COF flexible printed wiring board and method of producing the wiring board | Electricity | 84 | Expired |
| US6900989B2 | Flexible printed wiring board with semiconductor chip and releasing layer | Emerging Cross-Sectional Technologies | 6 | Expired |
| US7198989B2 | Method of producing a COF flexible printed wiring board | Electricity | 3 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.