Fabrication of microstructures with vacuum-sealed cavity
US6902656B2 · kind B2 · utility
29Cited by
15References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 24, 2002 |
| Grant date | Jun 7, 2005 |
| Priority date | — |
| Expiry date | Dec 30, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0167
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A cavity forming formed in an encapsulation structure under a vacuum in a vacuum chamber is sealed with a capping layer. A stiff protective layer under tensile stress is deposited on the capping layer prior to venting the vacuum chamber to atmospheric pressure. The capping layer is preferably aluminum or an aluminum alloy, and the protective layer is preferably δ-TiN having a suitable high Young's modulus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.