DALSA Semiconductor Inc.
35Patents
9Active
35Granted
42Portfolio score
Filing activity: Feb 5, 2001 → Jan 4, 2010 · 9 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6635509B1 | Wafer-level MEMS packaging | Electricity | 205 | Expired |
| US7365016B2 | Anhydrous HF release of process for MEMS devices | Performing Operations; Transporting | 201 | Expired |
| US6602791B2 | Manufacture of integrated fluidic devices | Performing Operations; Transporting | 74 | Expired |
| US7138293B2 | Wafer level packaging technique for microdevices | Electricity | 30 | Expired |
| US6902656B2 | Fabrication of microstructures with vacuum-sealed cavity | Performing Operations; Transporting | 29 | Expired |
| US7144750B2 | Method of fabricating silicon-based MEMS devices | Performing Operations; Transporting | 26 | Expired |
| US7160752B2 | Fabrication of advanced silicon-based MEMS devices | Performing Operations; Transporting | 19 | Expired |
| US7291513B2 | Hermetic wafer-level packaging for MEMS devices with low-temperature metallurgy | Performing Operations; Transporting | 14 | Expired |
| US6896821B2 | Fabrication of MEMS devices with spin-on glass | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6686214B2 | Method of aligning a photolithographic mask to a crystal plane | Electricity | 10 | Expired |
| US6656528B2 | Method of making specular infrared mirrors for use in optical devices | Physics | 10 | Expired |
| US7439093B2 | Method of making a MEMS device containing a cavity with isotropic etch followed by anisotropic etch | Performing Operations; Transporting | 9 | Active |
| US6555441B2 | Method of aligning structures on opposite sides of a wafer | Emerging Cross-Sectional Technologies | 8 | Expired |
| US6537623B2 | Manufacture of silica waveguides with minimal absorption | Physics | 7 | Expired |
| US6749893B2 | Method of preventing cracking in optical quality silica layers | Physics | 6 | Expired |
| US7807550B2 | Method of making MEMS wafers | Performing Operations; Transporting | 4 | Active |
| US7614253B2 | Method of reducing stress-induced mechanical problems in optical components | Physics | 4 | Active |
| US6770213B2 | Method of inspecting an anisotropic etch in a microstructure | Electricity | 4 | Expired |
| US7459329B2 | Method of fabricating silicon-based MEMS devices | Performing Operations; Transporting | 3 | Active |
| US7682860B2 | Protection capsule for MEMS devices | Performing Operations; Transporting | 3 | Active |
| US7037745B2 | Method of making electrical connections to hermetically sealed MEMS devices | Performing Operations; Transporting | 2 | Expired |
| US6573133B2 | Method of forming spacers in CMOS devices | Electricity | 2 | Expired |
| US6724967B2 | Method of making a functional device with deposited layers subject to high temperature anneal | Emerging Cross-Sectional Technologies | 2 | Expired |
| US7579622B2 | Fabrication of MEMS devices with spin-on glass | Emerging Cross-Sectional Technologies | 1 | Active |
| US6937806B2 | Method of making photonic devices with SOG interlayer | Physics | 1 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.