Method and apparatus for electro-chemical mechanical deposition
US6902659B2 · kind B2 · utility
35Cited by
21References
37Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 9, 2002 |
| Grant date | Jun 7, 2005 |
| Priority date | — |
| Expiry date | Oct 5, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention deposits a conductive material from an electrolyte solution to a predetermined area of a wafer. The steps that are used when making this application include applying the conductive material to the predetermined area of the wafer using an electrolyte solution disposed on a surface of the wafer, when the wafer is disposed between a cathode and an anode, and preventing accumulation of the conductive material to areas other than the predetermine area by mechanically polishing the other areas while the conductive material is being applied.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.