ASM Nutool, Inc.
42Patents
1Active
42Granted
36Portfolio score
Filing activity: Feb 27, 2001 → Apr 30, 2007 · 1 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7129165B2 | Method and structure to improve reliability of copper interconnects | Electricity | 540 | Expired |
| US7147766B2 | Chip interconnect and packaging deposition methods and structures | Electricity | 534 | Expired |
| US7172497B2 | Fabrication of semiconductor interconnect structures | Chemistry; Metallurgy | 531 | Expired |
| US6837979B2 | Method and apparatus for depositing and controlling the texture of a thin film | Electricity | 51 | Expired |
| US6902659B2 | Method and apparatus for electro-chemical mechanical deposition | Electricity | 35 | Expired |
| US6974769B2 | Conductive structure fabrication process using novel layered structure and conductive structure fabricated thereby for use in multi-level metallization | Electricity | 34 | Expired |
| US6852630B2 | Electroetching process and system | Electricity | 30 | Expired |
| US6857947B2 | Advanced chemical mechanical polishing system with smart endpoint detection | Performing Operations; Transporting | 22 | Expired |
| US6942780B2 | Method and apparatus for processing a substrate with minimal edge exclusion | Electricity | 21 | Expired |
| US6921551B2 | Plating method and apparatus for controlling deposition on predetermined portions of a workpiece | Emerging Cross-Sectional Technologies | 21 | Expired |
| US6958114B2 | Method and apparatus for forming an electrical contact with a semiconductor substrate | Electricity | 18 | Expired |
| US6946066B2 | Multi step electrodeposition process for reducing defects and minimizing film thickness | Electricity | 18 | Expired |
| US6988932B2 | Apparatus of sealing wafer backside for full-face processing | Electricity | 13 | Expired |
| US7029567B2 | Electrochemical edge and bevel cleaning process and system | Electricity | 12 | Expired |
| US6943112B2 | Defect-free thin and planar film processing | Chemistry; Metallurgy | 12 | Expired |
| US6942546B2 | Endpoint detection for non-transparent polishing member | Performing Operations; Transporting | 12 | Expired |
| US6936154B2 | Planarity detection methods and apparatus for electrochemical mechanical processing systems | Electricity | 11 | Expired |
| US7097538B2 | Advanced chemical mechanical polishing system with smart endpoint detection | Performing Operations; Transporting | 11 | Expired |
| US6939206B2 | Method and apparatus of sealing wafer backside for full-face electrochemical plating | Electricity | 10 | Expired |
| US6821409B2 | Electroetching methods and systems using chemical and mechanical influence | Electricity | 7 | Expired |
| US6866763B2 | Method and system monitoring and controlling film thickness profile during plating and electroetching | Electricity | 7 | Expired |
| US7189146B2 | Method for reduction of defects in wet processed layers | Electricity | 5 | Expired |
| US7045040B2 | Process and system for eliminating gas bubbles during electrochemical processing | Emerging Cross-Sectional Technologies | 4 | Expired |
| US7485561B2 | Filling deep features with conductors in semiconductor manufacturing | Electricity | 4 | Expired |
| US6855037B2 | Method of sealing wafer backside for full-face electrochemical plating | Electricity | 4 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.