Epoxy, epoxy system, and method of forming a conductive adhesive connection
US6902689B2 · kind B2 · utility
1Cited by
13References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2001 |
| Grant date | Jun 7, 2005 |
| Priority date | — |
| Expiry date | May 14, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2463/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention encompasses epoxies, epoxy systems, and methods of forming conductive adhesive connections between electrical nodes. An epoxy contains: a) a liquid mixture of a hardener and a base epoxy; and b) a concentration of an ionic salt within the liquid mixture, the concentration of the ionic salt being high enough that a 15 mil length sample of the liquid mixture having cross-sectional dimensions of 50 mil by 2 mil would have a resistance of less than about 100 ohms along its length.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.